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Chip On Board Mixer Quads
Features
s High Volume Automatic Assembly s For Microwave MIC Assembly and Automated High Volume Manufacturing s Mechanically Rugged Design s 100% DC Tested s Three Barrier Heights for Customized Mixer Performance
Description
Alpha's ceramic Chip on Board (COB) mixer quads are designed for high performance RF and microwave receiver applications. These devices utilize Alpha's advanced silicon beamless Schottky technology, combined with precision ceramic COB assembly techniques, to achieve a high degree of device reliability in commercial applications. Performance to 10 GHz is available with the ring quads in the 106 package, which employs via hole technology resulting in metalized contacts on the bottom side and eliminating the need for wire bonds to topside contacts.
Absolute Maximum Ratings
Characteristic Maximum Current (IMAX) Power Dissipation (PD) CW Storage Temperature (TST) Operating Temperature (TOP) ESD Human Body Model Value 50 mA 75 mW/Junction -65C to +175C -65C to +150C Class 1B
Alpha Industries, Inc. [781] 935-5150 * Fax [617] 824-4579 * Email sales@alphaind.com * www.alphaind.com
Specifications subject to change without notice. 6/99A
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Chip On Board Mixer Quads
Electrical Specifications at 25C
Part Number Barrier VF @ 1 mA (mV) Min. Ring Quad (to 6 GHz) DMF3926-101 DME3927-101 DMJ3928-101 Ring Quad (to 10 GHz) DMF3948-106 DME3949-106 DMJ3950-106 Low Medium High 250 350 575 310 450 675 15 15 15 0.05 0.05 0.05 0.15 0.15 0.15 0.07 0.07 0.07 15 15 15 106 106 106 Low Medium High 200 300 525 260 400 625 15 15 15 0.3 0.3 0.3 0.5 0.5 0.5 0.07 0.07 0.07 8 8 8 101 101 101 Max. () VF @ 1 mA1 (mV) Max. CJ @ 0 V (pF) Min. Max. () CT @ 0 V2 (pF) Max. RT @ 10 mA () Max. Outline Drawing
Crossover Ring Quad (to 6 GHz) DMF3926-100 DME3927-100 DMJ3928-100 Low Medium High 200 300 525 260 400 625 15 15 15 0.3 0.3 0.3 0.5 0.5 0.5 0.07 0.07 0.07 8 8 8 100 100 100
Back-to-Back Crossover Quad (to 6 GHz) DMF3945-103 DME3946-103 DMJ3947-103 Low Medium High 200 300 525 260 400 625 15 15 15 0.3 0.3 0.3 CJ @ 0 V (pF) Min. Max. 0.5 0.5 0.5 () CT @ 0 V2 (pF) Max. 0.07 0.07 0.07 RT @ 10 mA () Max. 8 8 8 VB @ 10 A (V) Min. 103 103 103
Part Number
Barrier
VF @ 1 mA (mV) Min. Max.
() VF @ 1 mA1 (mV) Max.
Outline Drawing
Bridge Quad (to 6 GHz) DMF3929-102 DME3930-102 Low Medium 200 300 260 400 15 15 0.3 0.3 0.3 0.5 0.5 0.5 0.07 0.07 0.07 8 8 8 2 3 4 102 102 102
DMJ3931-102 High 525 625 15 1. Forward voltage difference between package electrodes. 2. Capacitance difference between package electrodes.
SPICE Model Parameters (Per Junction)
Parameter IS RS N TT CJ0 M EG XTI FC BV IBV VJ V A V eV s pF Unit A DMF3926 DMF3929 DMF3945 2.5E-07 4 1.04 1E-11 0.42 0.32 0.69 2 0.5 2 1.0E-05 0.495 DME3927 DME3930 DME3946 1.3E-09 4 1.04 1E-11 0.39 0.37 0.69 2 0.5 3 1.0E-05 0.595 DMJ3928 DMJ3931 DMJ3947 9.0E-13 4 1.04 1E-11 0.39 0.42 0.69 2 0.5 4 1.0E-05 0.800 DMF3948 4.4E-08 9 1.04 1E-11 0.11 0.32 0.69 2 0.5 3 1.0E-05 0.495 DME3949 9.3E-10 9 1.04 1E-11 0.10 0.37 0.69 2 0.5 4 1.0E-05 0.595 DMJ3950 3.3E-13 9 1.04 1E-11 0.10 0.42 0.69 2 0.5 5 1.0E-05 0.800
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Alpha Industries, Inc. [781] 935-5150 * Fax [617] 824-4579 * Email sales@alphaind.com * www.alphaind.com
Specifications subject to change without notice. 6/99A
Chip On Board Mixer Quads
100, 101, 102
0.005 (0.13 mm) 0.001 (0.02 mm) TYP. INK DOT 0.010 (0.25 mm) DIA. MIN. COLOR PER INTERNAL SPECIFICATION
103
ORIENTATION DOT 0.020 (0.51 mm) 0.003 (0.08 mm) 0.140 (3.56 mm) 0.003 (0.08 mm) SCHEMATIC 2 DOT 1 0.026 (0.66 mm) MIN. () GLASS DAM 0.120 (3.05 mm) +0.002 (0.05 mm) -0.004 (0.10 mm) 0.020 (0.51 mm) X 0.010 (0.25 mm) ORIENTATION MARK 0.050 (1.27 mm) MAX. 0.025 (0.64 mm) 0.003 (0.08 mm) 6 5 0.130 (3.30 mm) 0.003 (0.08 mm) 3 4
0.100 (2.54 mm) +0.002 (0.05 mm) -0.004 (0.10 mm)
0.030 (0.76 mm) 0.003 (0.08 mm) SQ. EPOXY ENCAPSULATION (BLACK) 0.040 (1.02 mm) MAX. 0.020 (0.51 mm) 0.002 (0.05 mm)
0.020 (0.51 mm) 0.002 (0.05 mm)
GLASS NOT SHOWN FOR CLARITY
106
0.085 (2.159 mm) SQ.
CERAMIC SUBSTRATE Notes: 1. Bottom side is free of metalization. 2. The minimum specified area of the contact pads (0.017 x 0.022) shall be free of epoxy.
EPOXY ENCAPSULATION
0.003 (0.08 mm) TYP. EPOXY ENCAPSULATION 0.015 (0.38 mm) 0.003 (0.08 mm) TYP
45 REF.
0.017 (0.43 mm)
0.020 (0.51 mm) MAX. GLASS
0.026 (0.66 mm)
0.024 (0.61 mm)
GOLD METALIZATION
Pd/Pt /Ag METALIZATION
Alpha Industries, Inc. [781] 935-5150 * Fax [617] 824-4579 * Email sales@alphaind.com * www.alphaind.com
Specifications subject to change without notice. 6/99A
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